2026 International Conference on Electronic Circuits and Sensor Technology
Sponsored by Nanjing University of Information Science & Technology, and organized by School of Electronics & Information Engineering, Nanjing University of Information Science & Technology, the 2026 International Conference on Electronic Circuits and Sensor Technology (ECST 2026) will be held from June 12–14, 2026, in Nanjing, China. This conference aims to serve as a high-level forum for researchers, academics, and industry professionals to present their latest findings and exchange insights across the fields of electronic circuits and sensor technology.
As advances in microelectronics, artificial intelligence, and sensing systems continue to reshape the technological landscape, innovations in electronic circuits and sensor technology are driving breakthroughs in diverse applications—from intelligent devices and biomedical monitoring to environmental sensing and industrial automation. ECST 2026 will focus on emerging research areas such as analog and digital circuit design, signal processing, MEMS sensors, IoT-based sensing networks, embedded systems, and intelligent computing platforms, emphasizing the integration of hardware and software for smarter, more efficient systems.
The conference seeks to promote interdisciplinary collaboration and highlight future trends such as the convergence of electronic circuits and sensor technology. Join us in the historic city of Nanjing for an engaging and forward-looking academic exchange at ECST 2026!
Full Paper Submission Deadline: March 13, 2026
Registration Deadline: April 17, 2026
Final Paper Submission Deadline : May 08, 2026
Conference Dates: June 12-14, 2026
| Electronic Circuits and Systems | Sensor Technology | Emerging Trends and Applications |
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Analog and digital circuit design Mixed-signal and RF circuits Power electronics and converters Integrated circuits (IC) and System-on-Chip (SoC) design Low-power and energy-efficient circuits Embedded systems and microcontrollers VLSI design and verification Circuit modeling, simulation, and optimization High-speed and high-frequency circuit technologies Electronic packaging, reliability, and thermal management |
Physical, chemical, and biological sensors Optical and infrared sensors MEMS/NEMS sensors and actuators Smart sensors and sensor networks Wireless and IoT-based sensing systems Image and vision sensors Biomedical and wearable sensors Sensor signal processing and data fusion
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AI and machine learning for circuit and sensor design Intelligent measurement and control systems Internet of Things (IoT) and Cyber-Physical Systems Robotics and automation sensing technologies Automotive and aerospace sensing systems Energy harvesting and self-powered sensors Advanced metrology and instrumentation 3D integration and heterogeneous systems Reliability and fault-tolerant sensor systems
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All submissions will undergo a double-blind peer review by 2-3 experts in relevant fields. Acceptance will be based on the quality of the paper and satisfactory revisions in response to reviewers’ comments. Accepted papers, following proper registration and presentation, will be included in the conference proceedings and submitted for indexing in EI Compendex and Scopus.
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| Nanjing University of Information Science & Technology, China |